Exhibition stand: C15
The Dandelion 3rd Gen lightweight module(4kg/㎡，2.5mm) offers enhanced fire resistance
Superior Fire Resistance: specially developed front and rear encapsulation materials. Passed the external fire exposure tests(by MPA, University of Stuttgart) and obtained the certifications for Class E and Broof(t1) for unlimited roofing pitches.
Improved Moisture Immunity & Reliability: Incorporates a thicker backsheet for greater protection against moisture ingress and long-term reliability.
Reduced Construction Costs: eliminates the need for a sub-construction system, simplifying installation and saving on material and labor costs.
Overall Higher Reliability: unique rear-side Planar Electrical Connection (PEC) technology combined with Insulating Encapsulation Composite(IEC) to replace the conventional soldering ribbon connection, which can eliminate the stress induced by the process of soldering and the soldering ribbon, increase the stability and decrease power degradation.
